Testing of materials for semiconductor technology ; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method ; homogeneously doped semiconductor wafers 半导体工艺材料检验.用涡流法无接触测定电阻率.均匀
2.
Testing of materials for semiconductor technology ; measurement of the geometric dimensions of semiconductor slices ; determination of flatness deviation of polished slices by means of the multiple beam interference 半导体工艺材料的检验.第3部分:半导体切片几何尺寸的
